FEMTO DLW Gen 1

Femtosecond laser direct writing of optical waveguides, Two dimensional patterning,TPP printing, etc.

  1. Supports complex vector graphics (DXF) and standard 2D import, editing, filling, and array processing.
  2. Supports three-axis linked spatial curve machining; software includes a spiral line planning submodule.
  3. Supports STL 3D graphic import and JPG, TIF 2D graphic import.
  4. Supports single-axis PSO.
Standard system components:
  • Imported negative pressure sample unit/non-negative pressure sample unit (with optical fiber holder).
  • 4F transmission optics and mechanical components.
  • Machine vision (coaxial/non-coaxial).
  • Software power control (optional real-time power detection).
  • Polarization conversion (manual/automatic).
  • Vortex vector light field modulation.
  • Automated integration of power attenuation and polarization modulation modules.
femtosecond laser:
  • output wavelength: 1030 nm±10nm,2H Acousto-Optical Modulator (AOM)
  • Max monopulse energy: ≥ 100 μJat 50 kHz (fundamental frequency output);
  • Average power: ≥5W;
  • Pulse width: <250 fs; Pulse Width Tuning range: 250fs-10ps
  • Power Stability:<0.5%@24h
  • Optical quality TEM00 M2<1.2 TEM00,M2< 1.3 (2H)
  • Adjustable repetition rate: To 1 MHz;
  • Pointing stability: <20 urad/” C.
  • Customized Biburst burst mode, GHz mode.
XYZ positioning system:
  • XYZ stroke 100x 100x 20mm. ( Z-axis air )
  • Positioning accuracy measured data: right
  • Repeatability XY s± 150nm, Z axis s±200nm
  • Straightness/runouts+/-2μm
  • Maximum speed XY ≥ 300mm/s, Z≥ 50mm/s
  • Maximum load 5KG.
  • Manual pitch adjustment platform with auxiliary leveling program.
Machine Vision System & Automatic Focusing:

1. Coaxial microscope observation system, enabling real-time observation of the laser processing status. Adjustable illumination intensity.

2. Switchable laser dichroic mirror for easy calibration of the laser spot.

3. 6M color camera, 3072×2048 pixels, 2.4µm pixel size, exposure time 0.11ms-12s, maximum 41fps.

4. Automatic focusing in the Z-axis.

5. Second Z-axis: travel range 50mm, repeat positioning accuracy ±1µm, load capacity 10kg.

Objective wheel, objective group:
  • Features:
  • Five-hole objective rotating with adjustable center (electric adjustment optional)
  • Imported Mitutoyo objective lens set:
    • 10X, NA0.3, working distance ≥ 30mm (UV only, not included)
    • 20X, NA0.45, working distance ≥ 15mm
    • 50X, NA0.65, working distance ≥ 9mm
  • Under the 50X objective, the laser focus coincides with the microscope imaging focal plane.
  • Under 50X, laser focal spot <1 μm.
Software:
  • The software meets the basic processing parameter adjustment requirements: the main interface allows direct adjustment of movement distance and speed; high-resolution camera integration is included in the same interface to monitor the processing status in real time.
  • Support at least four basic shape processing paths (line, circle, ellipse, rectangle) and array generation functions.
  • Support complex vector graphics (DXF) and regular 2D imports, editing, filling, and array processing.
  • Support three-axis linkage space curve processing, with a submodule for spiral line planning.
  • Support importing STL 3D graphics, as well as JPG and F 2D graphic imports.
  • Support PSO。
Marble Gantry:
  • The optical path is mounted on an optical vibration isolation platform to ensure stability during operation and block external interference. The optical system is structured on a marble gantry to prevent drift and vibration.
  • Fully shielded protective cover to ensure optimal laser shielding during processing, in compliance with safety standards.