FEMTO X LAB Gen 1

Femtosecond laser direct writing of optical waveguides, Two dimensional patterning,TPP printing, etc.

  1. Supports complex vector graphics (DXF) and standard 2D import, editing, filling, and array processing.
  2. Supports three-axis linked spatial curve machining; software includes a spiral line planning submodule.
  3. Supports STL 3D graphic import and JPG, TIF 2D graphic import.
  4. Supports single-axis PSO.

Standard system components:

  • Imported negative pressure sample unit/non-negative pressure sample unit (with optical fiber holder).
  • 4F transmission optics and mechanical components.
  • Machine vision (coaxial/non-coaxial).
  • Software power control (optional real-time power detection).
  • Polarization conversion (manual/automatic).
  • Vortex vector light field modulation.
  • Automated integration of power attenuation and polarization modulation modules.

femtosecond laser

  • output wavelength: 1030 nm±10nm,2H Acousto-Optical Modulator (AOM)
  • * Max monopulse energy: ≥ 100 μJat 50 kHz (fundamental frequency output);
  • * Average power: ≥5W;
  • * Pulse width: <250 fs; Pulse Width Tuning range: 250fs-10ps
  • # Power Stability:<0.5%@24h
  • # Optical quality TEM00 M2<1.2 TEM00,M2< 1.3 (2H)
  • Adjustable repetition rate: To 1 MHz;
  • # Pointing stability: <20 urad/” C.
  • Customized Biburst burst mode, GHz mode.

XYZ positioning system

  • a)XYZ stroke 100x 100x 20mm. ( Z-axis air )
  • b) Positioning accuracy measured data: right
  • c) Repeatability XY s± 150nm, Z axis s±200nm
  • d) Straightness/runouts+/-2μm
  • e) Maximum speed XY ≥ 300mm/s, Z≥ 50mm/s
  • f) Maximum load 5KG.
  • g) Manual pitch adjustment platform with auxiliary leveling program.

Machine Vision System & Automatic Focusing

a) Coaxial microscope observation system, enabling real-time observation of the laser processing status. Adjustable illumination intensity.


b) Switchable laser dichroic mirror for easy calibration of the laser spot.

c) 6M color camera, 3072×2048 pixels, 2.4µm pixel size, exposure time 0.11ms-12s, maximum 41fps.


d) Automatic focusing in the Z-axis.


e) Second Z-axis: travel range 50mm, repeat positioning accuracy ±1µm, load capacity 10kg.

Objective wheel, objective group

  • Features:
  • Five-hole objective rotating with adjustable center (electric adjustment optional)
  • Imported Mitutoyo objective lens set:
    • 10X, NA0.3, working distance ≥ 30mm (UV only, not included)
    • 20X, NA0.45, working distance ≥ 15mm
    • 50X, NA0.65, working distance ≥ 9mm
  • Under the 50X objective, the laser focus coincides with the microscope imaging focal plane.
  • Under 50X, laser focal spot <1 μm.

Software

a) The software meets the basic processing parameter adjustment requirements: the main interface allows direct adjustment of movement distance and speed; high-resolution camera integration is included in the same interface to monitor the processing status in real time.

b) Support at least four basic shape processing paths (line, circle, ellipse, rectangle) and array generation functions.

c) Support complex vector graphics (DXF) and regular 2D imports, editing, filling, and array processing.

d) Support three-axis linkage space curve processing, with a submodule for spiral line planning.

e) Support importing STL 3D graphics, as well as JPG and F 2D graphic imports.

f) Support PSO。

Marble Gantry

  • The optical path is mounted on an optical vibration isolation platform to ensure stability during operation and block external interference. The optical system is structured on a marble gantry to prevent drift and vibration.
  • Fully shielded protective cover to ensure optimal laser shielding during processing, in compliance with safety standards.